Palomar Technologies Model 3500-III performs fully automatic wafer scale packaging and advanced microelectronics assembly. This is a highly flexible system that can perform up to...
diginfo: movie.diginfo.tv - Die bonding systems the high mix low volume productions are diversifying. A new microchip assembly system from precise gauges supports the mounting...
Palomar Automated 3500 Die Bonder and Component Placement System transfers die from Gel Paks. Palomar's contract assembly division, Palomar Microelectronics, performs a variety of micro-optoelectronics...
Palomar Technologies' Model 6500 Eutectic Die Bonder has a large work area (6 x 12 inches) while still maintaining a compact footprint (4x4 ft area)....
Steady State Eutectic Die Attach is performed on a LED application using Palomar high reliability, ultra flexible die bonder. The Force/Scrub motion breaks the oxide...